⬆ UPSTREAM — SUPPLIERS10
ASML
Sole maker of EUV lithography machines
Shin-Etsu Chemical
World's largest silicon wafer supplier
SUMCO
#2 global silicon wafer supplier; duopoly with Shin-Etsu controls ~55% of world supply
Kokusai Electric
Critical supplier of batch ALD and CVD furnace systems essential for NAND and DRAM production
Lam Research
Leading supplier of etch and deposition equipment
Applied Materials
Largest semiconductor equipment maker by revenue
Tokyo Electron
Leading maker of etch and deposition equipment
KLA
Dominant maker of wafer inspection and metrology tools
NAURA Technology
China's largest semiconductor equipment maker (etch, deposition, thermal, cleaning); rose to 5th globally by sales in 2025/2026, behind only ASML, Applied Materials, Lam Research, and TEL; Entity Listed Dec 2024 with 139 other Chinese chip-tool firms
Empyrean Technology
China's largest domestic EDA vendor (Shenzhen ChiNext); holds ~6% of China's total EDA market but is the largest local player, competing against Cadence/Synopsys/Siemens EDA; increasingly adopted by CXMT, SMIC, and other Chinese fabs as the 2022 US EDA export restrictions bite
CXMT
China's leading DRAM maker, targeting DDR4/DDR5 at mature nodes without EUV
⬇ DOWNSTREAM — CUSTOMERS5
Alibaba Cloud
China's #1 cloud provider; deploys Alibaba Hanguang 800 AI chip (TSMC-fabbed) and Huawei Ascend; operates Qwen LLM
Tencent Cloud
China's #2 cloud provider; major AI GPU buyer pivoting to H20/Huawei Ascend after BIS export controls; operates Hunyuan LLM
Baidu
China's leading AI pioneer; designs Kunlun AI chips (Samsung-fabbed); operates ERNIE Bot LLM; major AI cloud infrastructure provider
ByteDance
TikTok/Douyin parent; one of the world's largest AI compute buyers; cut off from NVIDIA H100/H200 by Oct 2023 BIS advanced computing rules
Huawei Cloud
China's third-largest cloud provider; runs Huawei Ascend 910 AI clusters; closed-loop with HiSilicon — only Chinese cloud with end-to-end domestic chip+cloud stack
UPSTREAM — SUPPLIERS
ASML
Sole maker of EUV lithography machines
Shin-Etsu Chemical
World's largest silicon wafer supplier
SUMCO
#2 global silicon wafer supplier; duopoly with Shin-Etsu controls ~55% of world supply
Kokusai Electric
Critical supplier of batch ALD and CVD furnace systems essential for NAND and DRAM production
Lam Research
Leading supplier of etch and deposition equipment
Applied Materials
Largest semiconductor equipment maker by revenue
Tokyo Electron
Leading maker of etch and deposition equipment
KLA
Dominant maker of wafer inspection and metrology tools
NAURA Technology
China's largest semiconductor equipment maker (etch, deposition, thermal, cleaning); rose to 5th globally by sales in 2025/2026, behind only ASML, Applied Materials, Lam Research, and TEL; Entity Listed Dec 2024 with 139 other Chinese chip-tool firms
Empyrean Technology
China's largest domestic EDA vendor (Shenzhen ChiNext); holds ~6% of China's total EDA market but is the largest local player, competing against Cadence/Synopsys/Siemens EDA; increasingly adopted by CXMT, SMIC, and other Chinese fabs as the 2022 US EDA export restrictions bite
↓ all supply to CXMT ↓
CXMT
China's leading DRAM maker, targeting DDR4/DDR5 at mature nodes without EUV
↓ CXMT supplies to ↓
Alibaba Cloud
China's #1 cloud provider; deploys Alibaba Hanguang 800 AI chip (TSMC-fabbed) and Huawei Ascend; operates Qwen LLM
Tencent Cloud
China's #2 cloud provider; major AI GPU buyer pivoting to H20/Huawei Ascend after BIS export controls; operates Hunyuan LLM
Baidu
China's leading AI pioneer; designs Kunlun AI chips (Samsung-fabbed); operates ERNIE Bot LLM; major AI cloud infrastructure provider
ByteDance
TikTok/Douyin parent; one of the world's largest AI compute buyers; cut off from NVIDIA H100/H200 by Oct 2023 BIS advanced computing rules
Huawei Cloud
China's third-largest cloud provider; runs Huawei Ascend 910 AI clusters; closed-loop with HiSilicon — only Chinese cloud with end-to-end domestic chip+cloud stack
DOWNSTREAM — CUSTOMERS
QWhat is CXMT's role in the AI chip supply chain?
China's leading DRAM maker, targeting DDR4/DDR5 at mature nodes without EUV
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