Broadcom SUPPLY CHAIN TRACE

CHIP DESIGNERS🇺🇸 United States · AVGO · NASDAQ

Broadcom is a leading designer of custom AI ASICs for hyperscalers and the networking chips that interconnect GPU clusters — quietly powering a significant portion of AI infrastructure alongside NVIDIA. It designs custom TPUs for Google and AI accelerators for Meta, while its Tomahawk and Jericho switch ASICs form the high-speed fabric of most large AI data centers. CEO Hock Tan has guided toward –90 billion in custom AI ASIC revenue by FY2027, reflecting the growing trend of hyperscalers designing their own chips.

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TSMC

World's largest contract chip manufacturer

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FOUNDRIESfabricates ASICs for

Intel Foundry

US-based foundry ramping Intel 18A and 3nm nodes

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FOUNDRIESfabricates networking chips for

Arm Holdings

Dominant CPU/NPU IP licensor; virtually all AI chips in mobile, edge, and cloud use Arm instruction set

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CHIP IPlicenses CPU/NPU IP to

GlobalFoundries

US-headquartered mature-node foundry (14nm/22FDX) specializing in RF, defense, and automotive chips; key Western alternative to TSMC for non-advanced applications

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FOUNDRIESfabricates RF/networking chips for

UMC

Taiwan-based mature-node foundry (28nm–40nm) with ~6% global revenue share; key supplier for analog, mixed-signal, and display driver chips

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FOUNDRIESfabricates mature-node networking chips for

Samsung Foundry

Second-largest advanced foundry, competing at 3nm

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FOUNDRIESfabricates some networking chip dies for

Cadence

Leading EDA software provider; IC design tools (Virtuoso, Genus, Innovus) used by every advanced chip designer; US export-controlled to Chinese entities since 2022

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EDA TOOLSprovides EDA tools to

Synopsys

Largest EDA software provider; IC design and verification tools (Design Compiler, PrimeTime, VCS) essential for all advanced chip tapeouts; US export-controlled to Chinese entities

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EDA TOOLSprovides EDA tools to

ASE Technology

World's largest OSAT; packages AI chip dies from TSMC and Samsung for NVIDIA, AMD, Apple, and Qualcomm

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OSAT / PACKAGINGprovides packaged ASIC modules to

Amkor Technology

Second-largest OSAT; packages dies for NVIDIA, Qualcomm, Apple, and Broadcom; operates advanced 2.5D/3D packaging for AI chips

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OSAT / PACKAGINGprovides packaged ASIC modules to

Ibiden

Dominant supplier of IC substrates for advanced packages

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MATERIALSsupplies FC-BGA substrates to

SK Hynix

Leading HBM3/HBM3E supplier for AI accelerators

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MEMORY (HBM)supplies HBM memory to

Samsung Memory

World's largest DRAM and NAND supplier, ramping HBM3

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MEMORY (HBM)supplies HBM memory to

Micron

Only US-based DRAM and HBM maker

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MEMORY (HBM)supplies HBM memory to

all supply to Broadcom

Broadcom

Custom ASIC and networking chip designer for hyperscalers

UPSTREAM — SUPPLIERS ↑ · DOWNSTREAM — CUSTOMERS
~55% custom hyperscaler AI ASIC; ~80% data center Ethernet switching silicon
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Broadcom supplies to

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About this company

QWhat is Broadcom's role in the AI chip supply chain?

Custom ASIC and networking chip designer for hyperscalers

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