⬆ UPSTREAM — SUPPLIERS15
ASML
Sole maker of EUV lithography machines
Tokyo Electron
Leading maker of etch and deposition equipment
Applied Materials
Largest semiconductor equipment maker by revenue
KLA
Dominant maker of wafer inspection and metrology tools
Lam Research
Leading supplier of etch and deposition equipment
Shin-Etsu Chemical
World's largest silicon wafer supplier
Graphite (CN)
Dominant graphite producer for semiconductor crucibles, furnace components, and SiC substrates
Sumitomo Chemical
Key supplier of EUV photoresist and compound semiconductors
Tungsten (CN)
Dominant tungsten producer for chip metallization contacts and tooling
Germanium (CN)
Dominant germanium producer for SiGe transistors and fiber-optic preforms
SUMCO
#2 global silicon wafer supplier; duopoly with Shin-Etsu controls ~55% of world supply
JSR Corporation
Major EUV and ArF immersion photoresist supplier; taken private by Japan Investment Corporation in 2023
Entegris
Critical process materials supplier: CMP slurries, ultra-high-purity chemical delivery, and wafer carriers
SCREEN Holdings
Leading wafer cleaning and surface treatment equipment maker (~20% global market share)
Kokusai Electric
Critical supplier of batch ALD and CVD furnace systems essential for NAND and DRAM production
Samsung Foundry
Second-largest advanced foundry, competing at 3nm
⬇ DOWNSTREAM — CUSTOMERS8
NVIDIA
Dominant AI GPU designer (H100, H200, B200)
AMD
AI GPU designer challenging NVIDIA with MI300X
Qualcomm
Leading mobile SoC and edge AI chip designer (Snapdragon X Elite, Cloud AI 100 inferencing)
Broadcom
Custom ASIC and networking chip designer for hyperscalers
Marvell
Custom AI ASIC and networking chip designer for hyperscalers; key supplier of Arm-based data center networking and storage controllers to AWS, Azure, and Google
ASE Technology
World's largest OSAT; packages AI chip dies from TSMC and Samsung for NVIDIA, AMD, Apple, and Qualcomm
Amkor Technology
Second-largest OSAT; packages dies for NVIDIA, Qualcomm, Apple, and Broadcom; operates advanced 2.5D/3D packaging for AI chips
Baidu
China's leading AI pioneer; designs Kunlun AI chips (Samsung-fabbed); operates ERNIE Bot LLM; major AI cloud infrastructure provider
UPSTREAM — SUPPLIERS
ASML
Sole maker of EUV lithography machines
Tokyo Electron
Leading maker of etch and deposition equipment
Applied Materials
Largest semiconductor equipment maker by revenue
KLA
Dominant maker of wafer inspection and metrology tools
Lam Research
Leading supplier of etch and deposition equipment
Shin-Etsu Chemical
World's largest silicon wafer supplier
Graphite (CN)
Dominant graphite producer for semiconductor crucibles, furnace components, and SiC substrates
Sumitomo Chemical
Key supplier of EUV photoresist and compound semiconductors
Tungsten (CN)
Dominant tungsten producer for chip metallization contacts and tooling
Germanium (CN)
Dominant germanium producer for SiGe transistors and fiber-optic preforms
SUMCO
#2 global silicon wafer supplier; duopoly with Shin-Etsu controls ~55% of world supply
JSR Corporation
Major EUV and ArF immersion photoresist supplier; taken private by Japan Investment Corporation in 2023
Entegris
Critical process materials supplier: CMP slurries, ultra-high-purity chemical delivery, and wafer carriers
SCREEN Holdings
Leading wafer cleaning and surface treatment equipment maker (~20% global market share)
Kokusai Electric
Critical supplier of batch ALD and CVD furnace systems essential for NAND and DRAM production
↓ all supply to Samsung Foundry ↓
Samsung Foundry
Second-largest advanced foundry, competing at 3nm
↓ Samsung Foundry supplies to ↓
NVIDIA
Dominant AI GPU designer (H100, H200, B200)
AMD
AI GPU designer challenging NVIDIA with MI300X
Qualcomm
Leading mobile SoC and edge AI chip designer (Snapdragon X Elite, Cloud AI 100 inferencing)
Broadcom
Custom ASIC and networking chip designer for hyperscalers
Marvell
Custom AI ASIC and networking chip designer for hyperscalers; key supplier of Arm-based data center networking and storage controllers to AWS, Azure, and Google
ASE Technology
World's largest OSAT; packages AI chip dies from TSMC and Samsung for NVIDIA, AMD, Apple, and Qualcomm
Amkor Technology
Second-largest OSAT; packages dies for NVIDIA, Qualcomm, Apple, and Broadcom; operates advanced 2.5D/3D packaging for AI chips
Baidu
China's leading AI pioneer; designs Kunlun AI chips (Samsung-fabbed); operates ERNIE Bot LLM; major AI cloud infrastructure provider
DOWNSTREAM — CUSTOMERS
QWhat is Samsung Foundry's role in the AI chip supply chain?
Second-largest advanced foundry, competing at 3nm
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