Hua Hong Semiconductor Supply Chain & Export Controls

⬆ UPSTREAM — SUPPLIERS7

NAURA Technology

China's largest semiconductor equipment maker (etch, deposition, thermal, cleaning); rose to 5th globally by sales in 2025/2026, behind only ASML, Applied Materials, Lam Research, and TEL; Entity Listed Dec 2024 with 139 other Chinese chip-tool firms

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EQUIPMENTsupplies etch/deposition tools to

AMEC

China's leading etch-tool maker; SMIC has purchased 800+ AMEC tools; its CCP etch tools are also qualified in TSMC's 5nm/7nm volume lines; Commerce Entity Listed Jan 2024, though removed from the Pentagon's separate military-company list Dec 2024

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EQUIPMENTsupplies etch tools to

ASML

Sole maker of EUV lithography machines

Chokepoint🇳🇱

EQUIPMENTsupplies DUV immersion machines to

Applied Materials

Largest semiconductor equipment maker by revenue

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EQUIPMENTsupplies legacy CVD/etch tools to

Tokyo Electron

Leading maker of etch and deposition equipment

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EQUIPMENTsupplies legacy etch/dep tools to

Lam Research

Leading supplier of etch and deposition equipment

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EQUIPMENTsupplies legacy etch tools to

KLA

Dominant maker of wafer inspection and metrology tools

Chokepoint🇺🇸

EQUIPMENTsupplies inspection/metrology tools to

Hua Hong Semiconductor

One of the world's largest mature-node foundries (55nm-350nm analog/power/embedded-NVM), dual-listed HKEX and Shanghai STAR; absorbing sister fab Huali (~RMB 8.27B deal, ~38,000 wafers/month) in 2026 as China consolidates legacy-node capacity

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~2.6% global foundry revenue (mature nodes)

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⬇ DOWNSTREAM — CUSTOMERS1

JCET Group

China's largest OSAT and #3 globally after ASE and Amkor (~10.5% global OSAT revenue share); investing RMB 7.8B in a new Shanghai advanced-packaging plant (phase 1 in 2H 2028) targeting AI/HBM-class 2.5D/3D packaging

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OSAT / PACKAGINGships bare dies to OSAT for packaging

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