AIChipMapExport Controls

JCET Group SUPPLY CHAIN TRACE

OSAT / PACKAGING🇨🇳 China · 600584 · SSE

JCET Group (长电科技) is China's largest OSAT (outsourced assembly and test) company and the world's third-largest by revenue, behind Taiwan's ASE and the US's Amkor. JCET packages chips for SMIC and Hua Hong and announced a RMB 7.8 billion investment in a Shanghai advanced-packaging plant in 2026, targeting 2.5D/3D chiplet and HBM integration technology that commands premium pricing in the AI buildout.

→ View company page

UPSTREAM — SUPPLIERS

SMIC

China's largest foundry; capped at 14nm without EUV access; Entity Listed 2020

🇨🇳
FOUNDRIESships bare dies to OSAT for packaging

Hua Hong Semiconductor

One of the world's largest mature-node foundries (55nm-350nm analog/power/embedded-NVM), dual-listed HKEX and Shanghai STAR; absorbing sister fab Huali (~RMB 8.27B deal, ~38,000 wafers/month) in 2026 as China consolidates legacy-node capacity

🇨🇳
FOUNDRIESships bare dies to OSAT for packaging

↓ all supply to JCET Group ↓

JCET Group

China's largest OSAT and #3 globally after ASE and Amkor (~10.5% global OSAT revenue share); investing RMB 7.8B in a new Shanghai advanced-packaging plant (phase 1 in 2H 2028) targeting AI/HBM-class 2.5D/3D packaging

UPSTREAM — SUPPLIERS ↑ · DOWNSTREAM — CUSTOMERS ↓
~10.5% global OSAT revenue (#1 in China, #3 worldwide)
→ View company page

↓ JCET Group supplies to ↓

Huawei / HiSilicon

China's leading chip designer (Kirin mobile, Ascend AI); on US Entity List since 2019

🇨🇳
CHIP DESIGNERSprovides packaged chip modules to

DOWNSTREAM — CUSTOMERS

About this company

QWhat is JCET Group's role in the AI chip supply chain?

China's largest OSAT and #3 globally after ASE and Amkor (~10.5% global OSAT revenue share); investing RMB 7.8B in a new Shanghai advanced-packaging plant (phase 1 in 2H 2028) targeting AI/HBM-class 2.5D/3D packaging

View full company profile →