Key Product
Huawei Cloud EI (AI), Ascend 910-based ModelArts platform
Full briefing▼ Expand
Huawei Cloud Computing Technologies Co., Ltd. operates the cloud computing and AI infrastructure division of Huawei Technologies. It is China's third-largest public cloud provider by revenue after Alibaba Cloud (Aliyun) and Tencent Cloud, and is notable as the only major cloud globally that runs on entirely proprietary domestic AI accelerators at scale. Huawei Cloud's AI infrastructure is built on the Ascend AI chip family, designed by HiSilicon (Huawei's in-house chip design arm). The Ascend 910 (first-generation, fabricated by TSMC before 2020 export restrictions) and Ascend 910B (second-generation, fabricated by SMIC at approximately 7nm-class using DUV multi-patterning) form the GPU-equivalent compute backbone of Huawei Cloud's AI clusters. The ModelArts platform (Huawei Cloud's AI development platform) enables training and deployment of large language models, computer vision models, and speech recognition models on Ascend hardware — competing with AWS SageMaker, Azure ML, and Google Vertex AI. ModelArts is the primary deployment platform for Pangu Models, Huawei's foundation model family (NLP, image, scientific). The supply chain closed-loop is strategically significant: HiSilicon designs → SMIC fabricates → Huawei Cloud deploys. This is the only major cloud AI stack that does not depend on US-origin chips (no NVIDIA, no AMD), US-origin EDA tools (Cadence/Synopsys licenses are restricted), or TSMC fabrication for its current AI deployment. However, it comes with performance constraints: the Ascend 910B achieves roughly 60–70% of H100 performance on typical LLM training benchmarks, and SMIC's 7nm-class process has lower yields than TSMC's N7. Huawei Cloud is central to China's 'AI sovereignty' narrative — demonstrating that a large-scale AI cloud can operate entirely within a domestic supply chain. It is the primary beneficiary of ByteDance, Baidu, and other Chinese AI companies being denied access to NVIDIA H100/H200 hardware.
Connected companies
Tap a chip to trace that company's chain.
Critical path — raw silicon to deployment
The tightest single-source dependencies, in order.
MEMORY (HBM)
YMTC
Xtacking 3D NAND flash (232-layer)
MEMORY (HBM)
CXMT
DDR4 and LPDDR4X DRAM (19nm class)
CHIP DESIGNERS
Huawei / HiSilicon
Kirin 9000s (5G SoC), Ascend 910 AI accelerator
CLOUD PROVIDERS
Huawei Cloud
Huawei Cloud EI (AI), Ascend 910-based ModelArts platform
AI CONSUMERS
DeepSeek
DeepSeek-V3, DeepSeek-R1 (frontier reasoning model)
Export controls touching Huawei Cloud
Netherlands EUV & DUV Lithography Export Control (Sep 2023)
The Netherlands Ministry of Foreign Affairs required ASML to obtain export licenses for its deep-ultraviolet (DUV) lithography systems and extended the existing ban on EUV systems. ASML is the sole manufacturer of EUV machines globally; the controls prevent China from acquiring the equipment needed to produce chips at leading-edge nodes. The policy was developed in alignment with U.S. and Japanese export control frameworks.
▲ 12 companies affected
U.S.–Netherlands–Japan Trilateral Chip Equipment Alignment (Jan 2023)
Following extensive diplomatic negotiations, the United States, the Netherlands, and Japan reached an informal multilateral agreement — announced on or around January 27, 2023 — to align their semiconductor equipment export control frameworks. The Netherlands subsequently imposed DUV licensing requirements on ASML (effective September 2023), and Japan expanded its controls to 23 categories of advanced fab equipment (effective July 2023). The trilateral alignment effectively closed the most significant loopholes in restricting China's access to the equipment needed for leading-edge chip production, since restrictions by any single ally could previously be circumvented through the others.
▲ 12 companies affected
U.S. Entity List: SMIC (Dec 2020)
The U.S. Department of Commerce added SMIC — China's largest foundry — to the Entity List on December 18, 2020, citing the risk that equipment and materials supplied to SMIC could be diverted to military end uses. The listing subjects exports of advanced semiconductor manufacturing tools destined for SMIC to a presumption-of-denial license review for items that could enable production at 10nm or below. Existing licenses for mature-node tooling were largely allowed to continue, keeping SMIC operational at 14nm/28nm nodes while freezing its path to sub-10nm leading-edge production.
▲ 9 companies affected
QWho supplies Huawei Cloud?
Huawei Cloud relies on 3 upstream suppliers across the AI chip supply chain.
Huawei / HiSilicon (China's leading chip designer (Kirin mobile, Ascend AI); on US Entity List since 2019), YMTC (China's largest 3D NAND maker; Entity Listed Dec 2022, primarily serves domestic market), CXMT (China's leading DRAM maker, targeting DDR4/DDR5 at mature nodes without EUV).
QWhat does Huawei Cloud make?
China's third-largest cloud provider; runs Huawei Ascend 910 AI clusters; closed-loop with HiSilicon — only Chinese cloud with end-to-end domestic chip+cloud stack
Key products Huawei Cloud EI (AI), Ascend 910-based ModelArts platform