Export-Control Impact Simulator

U.S. Entity List: SMIC (Dec 2020)

ActiveEffective: 2020-12-18 · as of 2026-06-04Read more →

The U.S. Department of Commerce added SMIC — China's largest foundry — to the Entity List on December 18, 2020, citing the risk that equipment and materials supplied to SMIC could be diverted to military end uses. The listing subjects exports of advanced semiconductor manufacturing tools destined for SMIC to a presumption-of-denial license review for items that could enable production at 10nm or below. Existing licenses for mature-node tooling were largely allowed to continue, keeping SMIC operational at 14nm/28nm nodes while freezing its path to sub-10nm leading-edge production.

Current Status

Active. SMIC remains on the U.S. Entity List as of June 2026. The presumption-of-denial license review policy for advanced semiconductor manufacturing equipment capable of 10nm-and-below production remains in effect. In June 2025, Taiwan's Ministry of Economic Affairs independently added SMIC to its own SHTC export control entity list. Multiple SMIC subsidiaries have been separately designated under Foreign Direct Product (FDP) rules alongside Huawei-connected fabs.

3
Companies cut off
Tiers in cascade
9
Companies in cascade

Company cascade

Who loses access when this control fires — directly and downstream.

CHIP DESIGNERS
FOUNDRIES
CLOUD PROVIDERS
CLOUD PROVIDERS
CLOUD PROVIDERS
CLOUD PROVIDERS
CLOUD PROVIDERS
7070 unaffected companies (shown for context)
CHIP DESIGNERS
OSAT / PACKAGING
AI CONSUMERS
EDGE DEVICES
OSAT / PACKAGING
EQUIPMENT
CLOUD PROVIDERS
CHIP DESIGNERS
EDA TOOLS
CHIP DESIGNERS
CLOUD PROVIDERS
MEMORY (HBM)
AI CONSUMERS
MATERIALS
RAW MATERIALS
RAW MATERIALS
CLOUD PROVIDERS
CHIP DESIGNERS
MATERIALS
CHIP DESIGNERS
MATERIALS
EQUIPMENT
EQUIPMENT
CHIP DESIGNERS
CHIP DESIGNERS
AI CONSUMERS
MEMORY (HBM)
CLOUD PROVIDERS
AI CONSUMERS
✓ UnaffectedNTT · 🇯🇵 Japan
CLOUD PROVIDERS
CHIP DESIGNERS
AI CONSUMERS
EDGE DEVICES
CLOUD PROVIDERS
CHIP DESIGNERS
SERVER ODMs
FOUNDRIES
RAW MATERIALS
MEMORY (HBM)
EDGE DEVICES
EQUIPMENT
MATERIALS
MEMORY (HBM)
CLOUD PROVIDERS
MATERIALS
SERVER ODMs
EDA TOOLS
EQUIPMENT
FOUNDRIES
RAW MATERIALS
FOUNDRIES
POWER & COOLING
SERVER ODMs
AI CONSUMERS
EDGE DEVICES
MEMORY (HBM)

Cascade timeline

How the restriction propagates tier by tier.

  1. 1

    Rule applied

    • Restricting country: 🇺🇸 United States
    • Applied Materials → SMIC
    • Lam Research → SMIC
    • KLA → SMIC
  2. 2

    Round 1

    • SMIC
  3. 3

    Round 2

    • Huawei / HiSilicon
    • Cambricon
    • Biren Technology
  4. 4

    Round 3

    • Huawei Cloud
    • Alibaba Cloud
    • ByteDance
    • Baidu
    • Tencent Cloud

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